Featuring a copper base soldered to an aluminum heat sink, the entire unit weighs in at 225g, making it one of the lighter heat sinks out there. It did not come with thermal pad.

The heat sink is wider than the socket. Even though it has a wide base, it's only about 3.2 cm tall so it is one of the thinnest heat sinks in my 'collection'. The CB-6L utilizes a relatively thick fin design so it looks just like the typical OEM-type heat sink. It was designed as a low profile heat sink to be coupled with a low profile fan, in order to fit inside tiny cases, especially mini towers with a power supply unit placed over the processor socket.

There are 22 rows of fins, separated by the mounting clip.

It's not the smoothest base I've seen but it is reasonably flat. They basically soldered the copper plate onto the aluminium heat sink.

The soldering job looks a bit sloppy but what really interests me is the performance and you can't see a thing when it's mounted onto your processor, right?

Nothing to shout about. A very conventional design except for the soldered copper base. The elder brother SK-6 had proven that soldering actually improves the thermal transfer, which is why Thermalright chose to use the same method with the CB-6L.